Waldent Nanobond SE (7th Gen Bonding Agent)

Composition:

• Bisphenol A-Glycidyl Methacrylate
• Urethane Dimethacrylate
• Triethylene Glycol Dimethacrylate
• 10-Methacryloyloxydecyl Dihydrogen Phosphate2-Hydroxyethyl Methacrylate
• Camphorquinone (Photoinitiator)
• Dimethyl Amino Ethyl Methacrylate
• Ethyl 4-dimethyl Amino Benzoate
• Butylated Hydroxytoluene
• Bond Strength: 38.2MPa

• Thoroughly clean the tooth surface using standard dental cleaning methods, such as brushing with fluoride toothpaste and scaling to remove any plaque or tartar buildup.
• Carefully prepare the cavity, removing all decayed or damaged tooth structures using appropriate dental instruments. Ensure that the cavity walls are clean and free of debris.
• Create a dry and isolated field using a rubber dam or other isolation techniques to protect the tooth from saliva and maintain a clean working environment.
• Apply a protective liner, such as a calcium hydroxide material, to areas where the remaining dentin is thin. Avoid using materials containing eugenol.
• If the Nanobond SE has been refrigerated, allow it to equilibrate to room temperature before use.
• Dispense an appropriate amount of the bonding agent onto a mixing well. Use an applicator brush to apply the material evenly on the entire inner surface of the cavity. Ensure that the dispensed material is used by a single patient to prevent cross-contamination.
• Allow the applied dental filling material to sit undisturbed for approximately 10 seconds. Then, use a gentle stream of air to dry the material for about 5 seconds
• Using a dental light-curing unit, initiate the light-curing process for 10-20 seconds based on the intensity and wavelength of the LED curing light. To protect both the operator and the patient, wear appropriate protective eyewear, and shield the patient's eyes from direct exposure to the curing light

• Simplifies the bonding procedure by eliminating the need for separate etching and rinsing steps.
• Reduces the risk of post-operative sensitivity and marginal leakage by preserving the smear layer.
• Provides reliable bond strength to both enamel and dentin.
• Exhibits excellent marginal adaptation and sealing.
• Compatible with most direct restorative materials.
• Simplifies the bonding procedure by eliminating the need for separate etching and rinsing steps.
• Reduces the risk of post-operative sensitivity and marginal leakage by preserving the smear layer.
• Provides reliable bond strength to both enamel and dentin.
• Exhibits excellent marginal adaptation and sealing.
• Compatible with most direct restorative materials.