TDV Microcut Kit - Dental Orthodontic Instruments

Rs. 2,719.00
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Specifications
Care Instruction
Features
  • Device developed to adapt special components:
    Saw Blade: – remove surplus material without damage the contact point
    thickness of only 0,05mm
  • Diamond Strip: – allows to perform the stripping in orthodontic procedures
    thickness of only 0,1mm
  • Easy and Safe handling
  • All components are autoclavable
  • Device developed to adapt special components:
    Saw Blade: – remove surplus material without damage the contact point
    thickness of only 0,05mm
  • Diamond Strip: – allows to perform the stripping in orthodontic procedures
    thickness of only 0,1mm
  • Easy and Safe handling
  • All components are autoclavable
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Categories: consumables TDV
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Description

Hack-saw frame designed to remove excesses from the interproximal area. Designed to removal excesses of composites, adhesives, cements and amalgams from the proximal area. Also indicated for Inlay and Onlay, laminated vaneers and stripping in orthodontic procedures.

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